Evidence map›Paper›PMID 42195542›Full record

ArticleMicromachines2026

A Comprehensive Experimental and Finite Element Analysis Study on the Bonding Strength Evaluation of Wafer-to-Wafer Hybrid Bonding with Polyimide Film Dielectrics.

Cong Mei, Tianze Zheng, Ziyang Ding, Dan Zhang, Yuan Xu, Huiyao Zhao, Liu Chang, Qiuhan Hu, Chenhui Xia, Shuli Liu and 1 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Micromachines, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

11 authors.

Cong MeiSchool of Integrated Circuits, Southeast University, Wuxi 214000, China.
Tianze ZhengSchool of Integrated Circuits, Southeast University, Wuxi 214000, China.
Ziyang DingSchool of Integrated Circuits, Southeast University, Wuxi 214000, China.
Dan ZhangSchool of Integrated Circuits, Southeast University, Wuxi 214000, China.
Yuan XuSchool of Integrated Circuits, Southeast University, Wuxi 214000, China.
Huiyao ZhaoSchool of Integrated Circuits, Southeast University, Wuxi 214000, China.
Liu ChangSchool of Integrated Circuits, Southeast University, Wuxi 214000, China.
Qiuhan HuSchool of Advanced Technology, Xi'an Jiaotong-Liverpool University, Suzhou 215123, China.
Chenhui XiaThe 58th Research Institute of China Electronics Technology Group Corporation, Wuxi 214000, China.
Shuli LiuThe 58th Research Institute of China Electronics Technology Group Corporation, Wuxi 214000, China.
Liyi LiSchool of Integrated Circuits, Southeast University, Wuxi 214000, China.ORCID 0000-0003-2154-1036

Funding

Electronic Packaging Technologies Oriented to Large-Scale Chiplet Integration of The 58th Re-search Institute of China Electronics Technology Group Corporation Project#6906013157the National Natural Science Foundation of China 92373204the Natural Science Foundation of Jiangsu Province of China BK20230830
6 · The paper itself

Abstract

Polymer insulation layers such as polyimide (PI) have gradually replaced inorganic dielectric layers (SiO

Indexed as

bonding strengthfinite element analysis (FEA)hybrid bonding (HB)nanoindentationpolyimide (PI) dielectricpost-crack Di-cantilever bending (PBC-DCB)

Identifiers

PMID42195542
PMCPMC13209387

What OpenQuestion holds

Textmetadata
LicenceCC BY
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Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.