Preparation and Properties Study of a Thermal Conductive Silicone Adhesive Applied in Advanced Packaging.

Yuwen Xu, Liangjun Liu, Wenfei Wang, Minghua Jiang, Haibing Yang, Tingxin Chen, Kun Jia

Abstract read

In one paragraph

Article in Micromachines, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

0numbers the graph read from it

0cells of the map it votes in

1citing papers in PubMed

–field-weighted citation impact

1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

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Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

Linking Surface Wettability to Interfacial Thermal Transport at Ti-Water Interfaces: A Molecular Dynamics Study.Micromachines · 2026
Article

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

7 authors.

Yuwen XuSchool of Materials Science and Engineering, South China University of Technology, Guangzhou 510641, China.

Liangjun LiuU-Bond Technology Inc., Dongguan 523800, China.

Wenfei WangU-Bond Technology Inc., Dongguan 523800, China.

Minghua JiangU-Bond Technology Inc., Dongguan 523800, China.

Haibing YangU-Bond Technology Inc., Dongguan 523800, China.

Tingxin ChenSchool of Materials Science and Engineering, South China University of Technology, Guangzhou 510641, China.

Kun JiaSchool of Materials Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China.

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

In 2.5D/3D stacked advanced packaging, thermal conductive silicone adhesives are widely employed to achieve structural bonding and efficient heat dissipation. In this study, one thermal conductive silicone adhesive was prepared using medium viscosity vinyl silicone oil, hydrogen-containing silicone oil, and micron-sized alumina powder as the primary components. The results demonstrated that the adhesive exhibited excellent thermal and mechanical performance. Specifically, its thermal decomposition temperature exceeded 400 °C, the thermal conductivity reached over 1.80 W·m

Indexed as

advanced packagingshear strengththermal conductive silicone adhesivesthermal conductivity

Identifiers

PMID42076171

DOI10.3390/mi17040394

PMCPMC13117291

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LicenceCC BY

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Registered trials

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.