ArticleMicromachines2026
Preparation and Properties Study of a Thermal Conductive Silicone Adhesive Applied in Advanced Packaging.
Yuwen Xu et al.PubMed ↗Full text ↗Publisher ↗
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ArticleMicromachines2026
Yuwen Xu et al.PubMed ↗Full text ↗Publisher ↗
No numbers read from the abstract.