ArticleAdvanced science (Weinheim, Baden-Wurttemberg, Germany)2026
Chemical Mechanical Polishing of Plasma-Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding.
Article in Advanced science (Weinheim, Baden-Wurttemberg, Germany), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.
What it found
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
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Who cites it
1 citing paper in PubMed.
- Chemical Mechanical Polishing of Plasma-Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2026Article
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Authors and funding
6 authors.
Funding
Abstract
Hybrid bonding, referring to direct bonding between metal and insulator layers, has become a key technology for next-generation semiconductor packaging, enabling high-density interconnects, fast signal transmission, and a compact form factor. Polymer dielectrics such as benzocyclobutene (BCB) provide excellent insulation and adhesion but pose challenges for chemical mechanical polishing (CMP) due to their viscoelasticity. Here, a CMP-compatible strategy based on argon (Ar) plasma modification of BCB is proposed to enable effective planarization of Cu/BCB hybrid bonding interfaces. Ar plasma treatment increases surface hardness and brittleness of half-cured BCB and increases hydrophilicity. The resulting wrinkle structures improve the flow of abrasive particles and slurry, enabling a plowing-dominant removal mechanism for precision planarization. Modified BCB shows a removal rate of up to 17.3 nm s
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Registered trials
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