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ArticleAdvanced science (Weinheim, Baden-Wurttemberg, Germany)2026

Chemical Mechanical Polishing of Plasma-Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding.

Sukkyung Kang et al.PubMed ↗Full text ↗Publisher ↗

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2026
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Full record →Abstract, authors, funding and every citing paper · PMID 41159511