Numerical Simulation of Thermal Cycling and Vibration Effects on Solder Layer Reliability in High-Power Diode Lasers for Space Applications.

Lei Cheng, Huaqing Sun, Xuanjun Dai, Bingxing Wei

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In one paragraph

Article in Micromachines, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 1 paper.

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1citing papers in PubMed

–field-weighted citation impact

1 · What the graph read from it

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3 · Its place in the literature

Who cites it

1 citing paper in PubMed.

Multiscale Modeling of Thermo-Electro-Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis.Micromachines · 2025
Article

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5 · Who and what money

Authors and funding

4 authors.

Lei ChengCollege of Mechanical and Control Engineering, Guilin University of Technology, Guilin 541000, China.

Huaqing SunCollege of Mechanical and Control Engineering, Guilin University of Technology, Guilin 541000, China.

Xuanjun DaiCollege of Mechanical and Control Engineering, Guilin University of Technology, Guilin 541000, China.

Bingxing WeiCollege of Mechanical and Control Engineering, Guilin University of Technology, Guilin 541000, China.

Funding

Shanxi Province Science and Technology Major Project 202201030201009

6 · The paper itself

Abstract

High-power laser diodes (HPLDs) are increasingly used in space applications, yet solder layer (SL) reliability critically limits their performance and lifespan. This study employs finite element analysis to evaluate SL failure mechanisms in microchannel-cooled HPLDs with two packaging configurations under thermal cycling and vibration. Based on the Anand constitutive model, contour plot analysis revealed that the critical stress-strain regions in both SLs were located at their edges. The stress-strain values along the X-axis of the SLs exceeded those in other axial directions, and SL failure would preferentially initiate from the edges along the cavity length direction. During random vibration analysis with excitation applied along the Z-axis, the equivalent stresses in both SLs exceeded X-/Y-axis levels. However, these values remained far below their yield strengths, indicating that only elastic strain and high-cycle fatigue occurred in the SLs. The calculated thermal fatigue lives of the two SLs were 2851 cycles and 5730 cycles, respectively. Their random vibration fatigue lives were determined as 5.75 × 10

Indexed as

high-power laser diodelife predictionrandom vibrationsolder layerspace environmentthermal cycling

Identifiers

PMID40731655

DOI10.3390/mi16070746

PMCPMC12298965

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.