← Evidence map

ArticleMicromachines2025

Numerical Simulation of Thermal Cycling and Vibration Effects on Solder Layer Reliability in High-Power Diode Lasers for Space Applications.

Lei Cheng et al.PubMed ↗Full text ↗Publisher ↗

No numbers read from the abstract.

1 paper cites it

2025
this papercites it
Full record →Abstract, authors, funding and every citing paper · PMID 40731655