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ArticleACS applied materials & interfaces2025

Current-Induced Evolving Mechanical Properties, Formation of Defects, and Interfacial Intermetallic Growth in the Interconnects Bonded with Au Wire.

Xiaohong Yuan et al.PubMed ↗Full text ↗Publisher ↗

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Full record →Abstract, authors, funding and every citing paper · PMID 40511769