ReviewNanoscale advances2025
Advances in core technologies for semiconductor manufacturing: applications and challenges of atomic layer etching, neutral beam etching and atomic layer deposition.
Review in Nanoscale advances, 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 4 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
4 citing papers in PubMed.
- Atomic Force Microscopy (AFM)-Based Metrology for Advanced Etching in Three-Dimensional Integrated Circuits.Micromachines · 2026Review
- Cryogenic-Assisted Hydrogen Fluoride Surface Reactions Enabling Reversibly Ultra-High Selectivity of Atomic Layer Etching Between SiOSmall methods · 2026Article
- Role of Nonplasma Oxidizing Agent on the Reaction Step in Atomic Layer Deposition of Titanium Oxide Thin Films.ACS omega · 2025Article
- Advanced BClSensors (Basel, Switzerland) · 2025Article
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
9 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
This article comprehensively reviews the technological advancements, emerging materials, processing techniques adopted (atomic layer deposition, atomic layer etching, and neutral beam etching), geometric influences, and fabrication challenges in the development of advanced semiconductor devices. These technologies are recognized for their precision at the atomic scale and are crucial in fabricating next-generation silicon photonics optoelectronic devices. They also play an important role in the development of RF/power third-generation compound semiconductors and advanced semiconductor devices. Atomic layer deposition (ALD) offers superior control over thin film growth, ensuring uniformity and material conformity. Atomic layer etching (ALE) enables precise layer-by-layer material removal, making it ideal for high-aspect-ratio structures. Neutral beam etching (NBE) minimizes surface damage, a key factor in maintaining device reliability, particularly for GaN-based semiconductors. This article also assesses the role of these technologies in enhancing semiconductor device performance, with a focus on overcoming the limitations of traditional methods. The combined application of ALD, ALE, and NBE technologies is driving innovations in advanced semiconductor fabrication, making these processes indispensable for advancements in areas such as micro-LEDs, optical communication, and high-frequency, high-power electronic devices.
Identifiers
What OpenQuestion holds
Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.