Evidence map›Paper›PMID 40137598›Full record

ArticleNanomaterials (Basel, Switzerland)2025

The Chemical Deformation of a Thermally Cured Polyimide Film Surface into Neutral 1,2,4,5-Benzentetracarbonyliron and 4,4'-Oxydianiline to Remarkably Enhance the Chemical-Mechanical Planarization Polishing Rate.

Man-Hyup Han, Hyun-Sung Koh, Il-Haeng Heo, Myung-Hoe Kim, Pil-Su Kim, Min-Uk Jeon, Min-Ji Kim, Woo-Hyun Jin, Kyoo-Chul Cho, Jinsub Park and 1 more

Abstract read
In one paragraph

Article in Nanomaterials (Basel, Switzerland), 2025. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

11 authors.

Man-Hyup HanDepartment of Nanoscale Semiconductor Engineering, Hanyang University, Seoul 04763, Republic of Korea.
Hyun-Sung KohDepartment of Electronic Engineering, Hanyang University, Seoul 04763, Republic of Korea.
Il-Haeng HeoDepartment of Electronic Engineering, Hanyang University, Seoul 04763, Republic of Korea.
Myung-Hoe KimDepartment of Electronic Engineering, Hanyang University, Seoul 04763, Republic of Korea.
Pil-Su KimDepartment of Nanoscale Semiconductor Engineering, Hanyang University, Seoul 04763, Republic of Korea.
Min-Uk JeonDepartment of Electronic Engineering, Hanyang University, Seoul 04763, Republic of Korea.ORCID 0009-0004-2908-9333
Min-Ji KimDepartment of Electronic Engineering, Hanyang University, Seoul 04763, Republic of Korea.
Woo-Hyun JinDepartment of Electronic Engineering, Hanyang University, Seoul 04763, Republic of Korea.
Kyoo-Chul ChoDepartment of Electronic Engineering, Hanyang University, Seoul 04763, Republic of Korea.
Jinsub ParkDepartment of Electronic Engineering, Hanyang University, Seoul 04763, Republic of Korea.ORCID 0000-0003-1079-5532
Jea-Gun ParkDepartment of Nanoscale Semiconductor Engineering, Hanyang University, Seoul 04763, Republic of Korea.ORCID 0000-0002-5831-2854

Funding

Korea Semiconductor Research Consortium 20019474Ministry of Trade, Industry and Energy 1415180388
6 · The paper itself

Abstract

The rapid advancement of 3D packaging technology has emerged as a key solution to overcome the scaling-down limitation of advanced memory and logic devices. Redistribution layer (RDL) fabrication, a critical process in 3D packaging, requires the use of polyimide (PI) films with thicknesses in the micrometer range. However, these polyimide films present surface topography variations in the range of hundreds of nanometers, necessitating chemical-mechanical planarization (CMP) to achieve nanometer-level surface flatness. Polyimide films, composed of copolymers of pyromellitimide and diphenyl ether, possess strong covalent bonds such as C-C, C-O, C=O, and C-N, leading to inherently low polishing rates during CMP. To address this challenge, the introduction of Fe(NO

Indexed as

CMP slurrypolyimide film CMPproton transfer reactionring-opening reactionsubstitution nucleophilic bimolecular reaction (SN2 reaction)wet ceria abrasives

Identifiers

PMID40137598
PMCPMC11944291

What OpenQuestion holds

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LicenceCC BY
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.