Evidence map›Paper›PMID 37374785›Full record

ReviewMicromachines2023

Emerging SiC Applications beyond Power Electronic Devices.

Francesco La Via, Daniel Alquier, Filippo Giannazzo, Tsunenobu Kimoto, Philip Neudeck, Haiyan Ou, Alberto Roncaglia, Stephen E Saddow, Salvatore Tudisco

Abstract readReview
In one paragraph

Review in Micromachines, 2023. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 15 papers.

0numbers the graph read from it
0cells of the map it votes in
15citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

15 citing papers in PubMed.

  1. Article
  2. Article
  3. Article
  4. Review
  5. Mechanisms and advances in field assisted machining of SiC.The International journal, advanced manufacturing technology · 2026
    Review
  6. Article
  7. Article
  8. Article
  9. Review
  10. Article
  11. Article
  12. Article
  13. A resilient type-III broken gap GaScientific reports · 2024
    Article
  14. Investigations of InNanomaterials (Basel, Switzerland) · 2024
    Article
  15. Article
4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

9 authors.

Francesco La ViaCNR-IMM, Strada VIII, 5, 95121 Catania, Italy.ORCID 0000-0002-6842-581X
Daniel AlquierGREMAN, UMR 7347, Université de Tours, CNRS, 37071 Tours, France.ORCID 0000-0003-1345-8195
Filippo GiannazzoCNR-IMM, Strada VIII, 5, 95121 Catania, Italy.ORCID 0000-0002-0074-0469
Tsunenobu KimotoDepartment of Electronic Science and Engineering, Kyoto University, Nishikyo, Kyoto 615-8510, Japan.
Philip NeudeckNASA Glenn Research Center, 21000 Brookpark Rd., Cleveland, OH 44135, USA.
Haiyan OuDepartment of Electrical and Photonics Engineering, Technical University of Denmark, Ørsteds Plads, Building 343, DK-2800 Kgs. Lyngby, Denmark.ORCID 0000-0002-0538-8230
Alberto RoncagliaCNR-IMM, 40129 Bologna, Italy.ORCID 0000-0001-9819-7603
Stephen E SaddowElectrical Engineering Department, University of South Florida, 4202 E. Fowler Avenue, ENG 030, Tampa, FL 33620, USA.ORCID 0000-0001-7141-8146
Salvatore TudiscoINFN-LNS, Via Santa Sofia 62, 95124 Catania, Italy.ORCID 0000-0002-9390-9912

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

In recent years, several new applications of SiC (both 4H and 3C polytypes) have been proposed in different papers. In this review, several of these emerging applications have been reported to show the development status, the main problems to be solved and the outlooks for these new devices. The use of SiC for high temperature applications in space, high temperature CMOS, high radiation hard detectors, new optical devices, high frequency MEMS, new devices with integrated 2D materials and biosensors have been extensively reviewed in this paper. The development of these new applications, at least for the 4H-SiC ones, has been favored by the strong improvement in SiC technology and in the material quality and price, due to the increasing market for power devices. However, at the same time, these new applications need the development of new processes and the improvement of material properties (high temperature packages, channel mobility and threshold voltage instability improvement, thick epitaxial layers, low defects, long carrier lifetime, low epitaxial doping). Instead, in the case of 3C-SiC applications, several new projects have developed material processes to obtain more performing MEMS, photonics and biomedical devices. Despite the good performance of these devices and the potential market, the further development of the material and of the specific processes and the lack of several SiC foundries for these applications are limiting further development in these fields.

Indexed as

biomedical devicesdetectorshigh temperature devicesMEMSphotonicssilicon carbide

Identifiers

PMID37374785
PMCPMC10300968

What OpenQuestion holds

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LicenceCC BY
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Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.