ArticleMaterials (Basel, Switzerland)2022
Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process.
Article in Materials (Basel, Switzerland), 2022. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 7 papers.
What it found
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The trial behind it
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Who cites it
7 citing papers in PubMed.
- A Mode-Aware Hybrid Machine-Learning Framework for Full-Field Warpage Prediction of Fan-Out Panel-Level Packaging After Debonding.Materials (Basel, Switzerland) · 2026Article
- A Selective Deposition Strategy of Ultrathin Metal Layer on Sub-Micrometer-Pitch Cu Interconnection for Low-Temperature Hybrid Bonding.Small science · 2026Article
- Modeling and Simulation for Predicting Thermo-Mechanical Behavior of Wafer-Level Cu-PI RDLs During Manufacturing.Micromachines · 2025Article
- Development of GUI-Driven AI Deep Learning Platform for Predicting Warpage Behavior of Fan-Out Wafer-Level Packaging.Micromachines · 2025Article
- Delamination of Plasticized Devices in Dynamic Service Environments.Micromachines · 2024Review
- Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic Packaging.Materials (Basel, Switzerland) · 2023Article
- Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging.Materials (Basel, Switzerland) · 2023Article
Corrections and comments
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Authors and funding
6 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
This paper focuses on characterizing the evolution of warpage, effects of epoxy molding compound (EMC), and effects of carrier 2 (the second carrier in the process) of 12 inch RDL-first multi-die fan-out wafer-level packaging (FOWLP) during the manufacturing process. The linear viscoelasticity properties of EMC and polyimide (PI) were characterized using dynamic mechanical analysis (DMA) in the frequency domain at different temperatures., The elastic and viscoelastic model were used for PI and EMC, the finite element analyses (FEA) of the cured structure were carried out and the results were compared with the test results. The viscoelastic properties of the EMC in the FEA could predict the wafer warpage more accurately. The FEA and experiments were used to investigate the evolution of warpage. The molding had a great influence on the warpage. The effects of the EMC and carrier 2 were also investigated with FEA. The wafer warpage could be reduced by lowering the thickness of the EMC, increasing the thickness of carrier 2, and selecting EMC and carrier 2 with a matched coefficient of thermal expansion (CTE).
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Registered trials
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