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ArticleMaterials (Basel, Switzerland)2026

A Mode-Aware Hybrid Machine-Learning Framework for Full-Field Warpage Prediction of Fan-Out Panel-Level Packaging After Debonding.

Ming-Ching Huang et al.PubMed ↗Full text ↗Publisher ↗

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1 paper cites it

2026

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A Mode-Aware Hybrid Machine-Learning Framework for Full-Field Warpage Prediction of Fan-Out Panel-Level Packaging After Debonding. | OpenQuestion