ArticleSensors (Basel, Switzerland)2021
A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging.
Article in Sensors (Basel, Switzerland), 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 10 papers.
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Who cites it
10 citing papers in PubMed.
- A review of glass thermal reflow: method, device, and applications.Microsystems & nanoengineering · 2026Review
- Review of Research Advances in Gyroscopes' Structural Forms and Processing Technologies Viewed from Performance Indices.Sensors (Basel, Switzerland) · 2025Review
- Design, Analysis, and Simulation of a MEMS Tuning Fork Gyroscope with a Mechanical Amplification Structure.Micromachines · 2025Article
- Design, Fabrication and Characterization of Disk Resonator Gyroscope with Vibration and Shock Resistance.Sensors (Basel, Switzerland) · 2024Article
- Design and Modelling of MEMS Vibrating Internal Ring Gyroscopes for Harsh Environments.Sensors (Basel, Switzerland) · 2024Article
- Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes.Micromachines · 2023Article
- A Self-Oscillating Driving Circuit for Low-Q MEMS Vibratory Gyroscopes.Micromachines · 2023Article
- A Novel Packaged Ultra-High Q Silicon MEMS Butterfly Vibratory Gyroscope.Micromachines · 2022Article
- A Review of MEMS Vibrating Gyroscopes and Their Reliability Issues in Harsh Environments.Sensors (Basel, Switzerland) · 2022Review
- ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release.Micromachines · 2021Article
Corrections and comments
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Authors and funding
8 authors.
Funding
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Abstract
Tuning fork gyroscopes (TFGs) are promising for potential high-precision applications. This work proposes and experimentally demonstrates a novel high-Q dual-mass tuning fork microelectromechanical system (MEMS) gyroscope utilizing three-dimensional (3D) packaging techniques. Except for two symmetrically decoupled proof masses (PM) with synchronization structures, a symmetrically decoupled lever structure is designed to force the antiparallel, antiphase drive mode motion and eliminate low frequency spurious modes. Thermoelastic damping (TED) and anchor loss are greatly reduced by the linearly coupled, momentum- and torque-balanced antiphase sense mode. Moreover, a novel 3D packaging technique is used to realize high Q-factors. A composite substrate encapsulation cap, fabricated by through-silicon-via (TSV) and glass-in-silicon (GIS) reflow processes, is anodically bonded to the wafer-scale sensing structures. A self-developed control circuit is adopted to realize loop control and characterize gyroscope performances. It is shown that a high-reliability electrical connection, together with a high air impermeability package, can be fulfilled with this 3D packaging technique. Furthermore, the Q-factors of the drive and sense modes reach up to 51,947 and 49,249, respectively. This TFG realizes a wide measurement range of ±1800 °/s and a high resolution of 0.1°/s with a scale factor nonlinearity of 720 ppm after automatic mode matching. In addition, long-term zero-rate output (ZRO) drift can be effectively suppressed by temperature compensation, inducing a small angle random walk (ARW) of 0.923°/√h and a low bias instability (BI) of 9.270°/h.
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