ReviewMicromachines2021
Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G.
Review in Micromachines, 2021. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 10 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
10 citing papers in PubMed.
- Low-Temperature and Room-Temperature Surface-Activated Au-Au Bonding: Surface Requirements, Preparation Methods, and Emerging Applications.Sensors (Basel, Switzerland) · 2026Review
- Temperature-dependent microwave properties of vanadium dioxide film across the phase transition.iScience · 2026Article
- Dual-Passband SAW Filter Based on a 32°YX-LN/SiOMicromachines · 2023Article
- Machine learning-augmented surface-enhanced spectroscopy toward next-generation molecular diagnostics.Nanoscale advances · 2023Review
- Neuro-nanotechnology: diagnostic and therapeutic nano-based strategies in applied neuroscience.Biomedical engineering online · 2023Review
- MOF/Polymer-Integrated Multi-Hotspot Mid-Infrared Nanoantennas for Sensitive Detection of CONano-micro letters · 2022Article
- Reconfigurable terahertz metamaterials: From fundamental principles to advanced 6G applications.iScience · 2022Review
- Flexible multifunctional platform based on piezoelectric acoustics for human-machine interaction and environmental perception.Microsystems & nanoengineering · 2022Article
- Analysis of the Influence of Ferromagnetic Material on the Output Characteristics of Halbach Array Energy-Harvesting Structure.Micromachines · 2021Article
- Suspended Silicon Waveguide with Sub-Wavelength Grating Cladding for Optical MEMS in Mid-Infrared.Micromachines · 2021Article
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
4 authors.
Funding
Abstract
Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications of the thin films obtained by wafer bonding technology in the fields of electronics, optical devices, on-chip integrated mid-infrared sensors, and wearable sensors. The fabrication of silicon-on-insulator (SOI) wafers based on the Smart Cut
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What OpenQuestion holds
Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.