ArticleMicromachines2019
High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer.
Article in Micromachines, 2019. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 2 papers.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
2 citing papers in PubMed.
- A 3D Printing Strategy for Hard Curved Surfaced Circuits: From Materials to Applications.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2025Review
- Customizable, conformal, and stretchable 3D electronics via predistorted pattern generation and thermoforming.Science advances · 2021Article
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
6 authors.
Funding
Abstract
Modern design-conscious products have raised the development of advanced electronic fabricating technologies. These widely used industrial technologies show high compatibility for inorganic materials and capacity for mass production. However, the morphology accuracy is hard to ensure and cracks happen easily, which could cause the degradation of device performance and life span. In order to make high precision 3D conformable electronics, a thermal phase-changing adhesion interlayer and modified fabricating processes are used in self-developed equipment. The working principles and influencing factors such as heating time and geometry parameters are studied quantitatively. The accuracy of fabricated patterns is enhanced by this new technology and serpentine designed structures. The delamination or detachment are significantly alleviated. Due to the operation convenience and compatibility with existing materials, the presented fabrication method has great potential for mass production of 3D curved conformable electronics.
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Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.