ArticleMicromachines2019
High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer.
Kang Wu et al.PubMed ↗Full text ↗Publisher ↗
No numbers read from the abstract.
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ArticleMicromachines2019
Kang Wu et al.PubMed ↗Full text ↗Publisher ↗
No numbers read from the abstract.