Evidence map›Paper›PMID 29379201›Full record

ArticleNature materials2018

Morphable 3D mesostructures and microelectronic devices by multistable buckling mechanics.

Haoran Fu, Kewang Nan, Wubin Bai, Wen Huang, Ke Bai, Luyao Lu, Chaoqun Zhou, Yunpeng Liu, Fei Liu, Juntong Wang and 15 more

Abstract read
In one paragraph

Article in Nature materials, 2018. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Cited by 96 papers.

0numbers the graph read from it
0cells of the map it votes in
96citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

96 citing papers in PubMed.

  1. Review
  2. Article
  3. Review
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  5. Article
  6. Article
  7. Growth-Like Swelling of 2D Precursors for Efficient Fabrication of Complex 3D Microstructures.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2026
    Article
  8. Article
  9. Review
  10. Article
  11. Article
  12. Article
  13. Article
  14. FromMaterials today. Bio · 2025
    Review
  15. Article
  16. Review
  17. Article
  18. Article
  19. Article
  20. Bistable Soft Shells for Programmable Mechanical Logic.Advanced science (Weinheim, Baden-Wurttemberg, Germany) · 2025
    Article

36 more citing papers are in PubMed but not listed here.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

25 authors.

Haoran Fu *Center for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China.
Kewang Nan *Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.ORCID http://orcid.org/0000-0002-2745-0656
Wubin BaiDepartment of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
Wen HuangDepartment of Electrical and Computer Engineering Micro and Nanotechnology Laboratory International Institute for Carbon-Neutral Energy Research (I2CNER), University of Illinois at Urbana-Champaign, Urbana, IL, USA.
Ke BaiCenter for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China.
Luyao LuDepartment of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
Chaoqun ZhouDepartment of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
Yunpeng LiuDepartment of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
Fei LiuCenter for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China.
Juntong WangDepartment of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
Mengdi HanNational Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, China.
Zheng YanDepartment of Chemical Engineering and Department of Mechanical & Aerospace Engineering, University of Missouri, Columbia, MO, USA.
Haiwen LuanDepartments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
Yijie ZhangDepartment of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
Yutong ZhangDepartment of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
Jianing ZhaoDepartment of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
Xu ChengCenter for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China.
Moyang LiDepartment of Electrical and Computer Engineering Micro and Nanotechnology Laboratory International Institute for Carbon-Neutral Energy Research (I2CNER), University of Illinois at Urbana-Champaign, Urbana, IL, USA.
Jung Woo LeeDepartment of Materials Science and Engineering, Pusan National University, Busan, Republic of Korea.
Yuan LiuCenter for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China.
Daining FangInstitute of Advanced Structure Technology; Beijing Key Laboratory of Lightweight Multi-functional Composite Materials and Structures, Beijing Institute of Technology, Beijing, China.
Xiuling LiDepartment of Electrical and Computer Engineering Micro and Nanotechnology Laboratory International Institute for Carbon-Neutral Energy Research (I2CNER), University of Illinois at Urbana-Champaign, Urbana, IL, USA.
Yonggang HuangDepartments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.
Yihui ZhangCenter for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China. yihuizhang@tsinghua.edu.cn.
John A RogersDepartments of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science; Center for Bio-Integrated Electronics; and Simpson Querrey Institute for BioNanotechnology, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.

Funding

SCH: Interface Monitoring System to Promote Residual Limb HealthR01EB019337 · NIBIB · NORTHWESTERN UNIVERSITY AT CHICAGO · PI COLEMAN, TODD P, FATONE, STEFANIA · 2014 to 2017
$1.5M
NIBIB NIH HHS R01 EB019337
6 · The paper itself

Abstract

Three-dimensional (3D) structures capable of reversible transformations in their geometrical layouts have important applications across a broad range of areas. Most morphable 3D systems rely on concepts inspired by origami/kirigami or techniques of 3D printing with responsive materials. The development of schemes that can simultaneously apply across a wide range of size scales and with classes of advanced materials found in state-of-the-art microsystem technologies remains challenging. Here, we introduce a set of concepts for morphable 3D mesostructures in diverse materials and fully formed planar devices spanning length scales from micrometres to millimetres. The approaches rely on elastomer platforms deformed in different time sequences to elastically alter the 3D geometries of supported mesostructures via nonlinear mechanical buckling. Over 20 examples have been experimentally and theoretically investigated, including mesostructures that can be reshaped between different geometries as well as those that can morph into three or more distinct states. An adaptive radiofrequency circuit and a concealable electromagnetic device provide examples of functionally reconfigurable microelectronic devices.

Identifiers

PMID29379201
PMCPMC5877475

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.