ArticleSensors (Basel, Switzerland)2026
Modeling and Experimental Study of Cross-Electromechanical Admittance for Crack Localization in Beams with Distributed Piezoelectric Wafers.
Article in Sensors (Basel, Switzerland), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
This research developed a novel crack localization technique that employed cross-electromechanical admittance (EMA), and its validity was verified through both analytical simulations and experimental measurements. Initially, an analytical model of the cross-EMA was established based on the transfer matrix method (TMM), and subsequently verified by experimental data and finite element analysis. Using the established model, the cross-EMA signatures were then utilized for crack localization in conjunction with a damage index defined as the correlation coefficient (CC). Furthermore, experimental investigations were carried out on five steel specimens, each of which was instrumented with multiple surface-bonded Lead Zirconate Titanate (PZT) wafers in a distributed manner. A crack with a width of 1.5 mm and a depth of 8 mm was introduced into each specimen to simulate structural damage. Both analytical investigations and experimental research have demonstrated that the cross-EMA signatures exhibit crack localization capabilities and can precisely reflect the local mechanical characteristics of the monitored structure.
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