Evidence map›Paper›PMID 42844265›Full record

ArticleNature communications2026

Gate-level three-dimensional integration of two-dimensional logic cells.

Hang Zhao, Xiaofu Wei, Jinsen Shang, Yu Geng, Kuanglei Chen, Zhihong Cao, Yanzhe Zhang, Shihua Jiang, Xiankun Zhang, Zheng Zhang and 1 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Nature communications, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

11 authors.

Hang Zhao *Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, PR China.
Xiaofu Wei *Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, PR China.
Jinsen ShangAcademy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, PR China.
Yu GengAcademy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, PR China.
Kuanglei ChenAcademy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, PR China.
Zhihong CaoAcademy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, PR China.
Yanzhe ZhangAcademy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, PR China.
Shihua JiangAcademy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, PR China.
Xiankun ZhangAcademy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, PR China. zhangxiankun@ustb.edu.cn.ORCID http://orcid.org/0000-0001-9654-4659
Zheng ZhangAcademy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, PR China. zhangzheng@ustb.edu.cn.ORCID http://orcid.org/0000-0002-9104-7562
Yue ZhangAcademy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, PR China. yuezhang@ustb.edu.cn.ORCID http://orcid.org/0000-0002-8213-1420

Funding

China Postdoctoral Science Foundation BX20250290National Natural Science Foundation of China (National Science Foundation of China) 52188101, 52225206, 62322402, 52350301, 92463308, 62304019, 62504018
6 · The paper itself

Abstract

Monolithic three-dimensional (M3D) integration is a promising strategy to increase logic density within a limited footprint. Conventional M3D circuits rely on transistor-level partitioning, in which logic functions are constructed through interconnections among numerous transistors across different tiers, limiting circuit compactness. Here, we propose a gate-level M3D integration architecture based on two-dimensional (2D) logic cells (LCs), in which the basic interlayer connection unit is shifted from an individual transistor to a logic gate. Through multidimensional modulation of carrier transport in the WSe

Identifiers

PMID42844265
PMCPMC13645802

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.