ArticleNational science review2026
Multi-channel high-speed flip-chip packaging platform for thin-film lithium niobate photonic circuits.
Article in National science review, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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14 authors.
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Abstract
To address the urgent need for multi-channel high-speed electrical interfacing of thin-film lithium niobate (TFLN) photonic circuits, we realize a flip-chip packaging platform capable of simultaneously delivering 13 high-speed and 32 low-speed electronic signals to a centimeter-sized TFLN chip. The platform exhibits low flip-chip bonding loss and low inter-channel crosstalk over a broad bandwidth up to 50 GHz. Leveraging this packaging platform, we demonstrate high-speed electrical interfacing with two proof-of-concept TFLN photonic circuits, namely a 2 × 8 optical switch and an electro-optic comb-based transmitter. The switch achieves arbitrary 8-channel routing with ∼3 dB insertion loss, <-20 dB crosstalk, and an equipment-limited switching time of ≤34 ps. The transmitter circuit includes a 50 GHz electro-optic comb generator with 2.8-dB flatness, a tunable microring to arbitrarily filter one comb line, and a modulator for data transmission at 20 Gbit/s. The packaging platform could significantly advance large-scale TFLN circuits in optical communications, microwave photonics, and photonic computing.
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