ReviewSensors (Basel, Switzerland)2026
Low-Temperature and Room-Temperature Surface-Activated Au-Au Bonding: Surface Requirements, Preparation Methods, and Emerging Applications.
Review in Sensors (Basel, Switzerland), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
Gold-to-gold (Au-Au) bonding forms an oxide-resistant metallic interface without solder or conductive adhesive, making it attractive for heterogeneous integration, MEMS sealing, optoelectronic packaging, and flexible hybrid electronics (FHEs). This review focuses on low-temperature and room-temperature surface-activated Au-Au direct bonding and emphasizes the roles of surface roughness and activation state. Compared with thermocompression bonding (TCB), low-temperature and room-temperature bonding impose stricter surface requirements because heat and pressure in TCB can deform asperities and increase real contact area. Room-temperature bonding instead depends strongly on the surface condition before contact. Successful bonding generally requires very smooth Au surfaces, activation, and contamination control. Reported roughness ranges from below 0.5 nm for smooth sputtered or transferred Au films to tens or hundreds of nanometers for rough plated Au before smoothing. Smoothing strategies can therefore expand the direct-bonding process window. Plasma activation removes contaminants and increases surface reactivity; Ar plasma promotes strong bonding, whereas O
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