ArticleNanomaterials (Basel, Switzerland)2026
Hybrid Laser-Etching Fabrication of High-Density Antireflective Microstructures on DLC-Coated Silicon Using Burst-Mode Bessel Beam Processing.
Article in Nanomaterials (Basel, Switzerland), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
We demonstrate a novel method for fabricating densely packed, high-aspect-ratio cavities (depth to diameter ratio > 1) in silicon wafers coated with diamond-like carbon (DLC). The process combines femtosecond laser irradiation with subsequent wet etch (potassium hydroxide-based) or plasma etch (chlorine- and oxygen-based). The femtosecond laser is used to pattern precise openings in the DLC layer, exposing the underlying silicon, which is then rapidly etched to form well-defined cavities. This combined laser ablation and etching approach enables high-throughput fabrication of densely packed micrometer cavities and offers scalability toward industrial production. The resulting hybrid DLC-coated silicon structure, featuring densely packed cavities, may exhibit antireflective properties in the far-infrared spectrum range.
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