ArticleNature2026
Heterogeneous photonic integration of single-crystalline nanomembranes.
Abstract read
In one paragraph
Article in Nature, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
0 citing papers in PubMed.
No citing paper in PubMed yet.
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
43 authors.
Yuan Meng *Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO, USA.ORCID http://orcid.org/0000-0002-5409-5610
Wenbo Mao *Department of Electrical and Systems Engineering, Washington University in St. Louis, St. Louis, MO, USA.ORCID http://orcid.org/0000-0002-7406-0992
Zhihao Xu *Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO, USA.
Di Jia *Department of Electrical and Systems Engineering, Washington University in St. Louis, St. Louis, MO, USA.ORCID http://orcid.org/0009-0009-5063-0178
Mengxin LinInstitute of Physics, Swiss Federal Institute of Technology Lausanne (EPFL), Lausanne, Switzerland.
Jisung SeoDepartment of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA.
Bora KimHolonyak Micro and Nanotechnology Laboratory, University of Illinois Urbana-Champaign, Urbana, IL, USA.
Xinyuan ZhangDepartment of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.ORCID http://orcid.org/0000-0002-5135-2204
Eugene ParkDepartment of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.ORCID http://orcid.org/0000-0001-6573-9162
Seokje LeeDepartment of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.
Jekyung KimDepartment of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.ORCID http://orcid.org/0000-0002-8250-5736
Sangmoon HanDepartment of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO, USA.ORCID http://orcid.org/0000-0001-7924-2050
Ji-Yun MoonDivision of Electronics and Electrical Engineering, Dongguk University, Seoul, Republic of Korea.
Weijie XuDepartment of Electrical and Systems Engineering, Washington University in St. Louis, St. Louis, MO, USA.ORCID http://orcid.org/0009-0004-0307-3106
Qian ZhangDepartment of Electrical and Systems Engineering, Washington University in St. Louis, St. Louis, MO, USA.
Xiaoqing HeInstitute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO, USA.
Mingfeng ChenDepartment of Physics, Washington University in St. Louis, St. Louis, MO, USA.ORCID http://orcid.org/0000-0001-8408-0359
Sang Hyun NamDepartment of Energy Engineering, Hanyang University, Seoul, Republic of Korea.
Jianqi HuInstitute of Physics, Swiss Federal Institute of Technology Lausanne (EPFL), Lausanne, Switzerland.
Justin S KimInstitute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO, USA.
Sejin LeeInstitute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO, USA.
Sanggeun BaeInstitute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO, USA.ORCID http://orcid.org/0009-0005-1726-8868
Soo Ho ChoiHolonyak Micro and Nanotechnology Laboratory, University of Illinois Urbana-Champaign, Urbana, IL, USA.
Tae Hyung KimDepartment of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO, USA.
Yunseok ChoiDepartment of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO, USA.
Seung-Il KimDepartment of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO, USA.
Kyubeen KimDepartment of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO, USA.
Minho JinDepartment of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO, USA.ORCID http://orcid.org/0000-0001-8074-1391
Chen JiangDepartment of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO, USA.
Yiheng ZhangDepartment of Electrical and Systems Engineering, Washington University in St. Louis, St. Louis, MO, USA.
Young-Hoon KimDepartment of Energy Engineering, Hanyang University, Seoul, Republic of Korea.ORCID http://orcid.org/0000-0003-1810-6885
Jae-Hyun LeeDepartment of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea.ORCID http://orcid.org/0000-0001-5117-8923
Hobeom KimDepartment of Materials Science and Engineering, Gwangju Institute of Science and Technology, Gwangju, Republic of Korea.ORCID http://orcid.org/0000-0002-5296-8975
Sheng RanDepartment of Physics, Washington University in St. Louis, St. Louis, MO, USA.ORCID http://orcid.org/0000-0003-1557-267X
Xi WangDepartment of Physics, Washington University in St. Louis, St. Louis, MO, USA.ORCID http://orcid.org/0000-0002-0641-0882
Cheng-Wei QiuDepartment of Electrical and Computer Engineering, National University of Singapore, Singapore, Singapore.ORCID http://orcid.org/0000-0002-6605-500X
Frances M RossDepartment of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.ORCID http://orcid.org/0000-0003-0838-9770
Jeehwan KimDepartment of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.ORCID http://orcid.org/0000-0002-1547-0967
Minjoo Larry LeeDepartment of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA.ORCID http://orcid.org/0000-0002-3151-3808
Hyunseok KimDepartment of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA.ORCID http://orcid.org/0000-0003-3091-8413
Tobias J KippenbergInstitute of Physics, Swiss Federal Institute of Technology Lausanne (EPFL), Lausanne, Switzerland.ORCID http://orcid.org/0000-0002-3408-886X
Lan YangDepartment of Electrical and Systems Engineering, Washington University in St. Louis, St. Louis, MO, USA. yang@seas.wustl.edu.ORCID http://orcid.org/0000-0002-9052-0450
Sang-Hoon BaeDepartment of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO, USA. sbae22@wustl.edu.ORCID http://orcid.org/0000-0002-1518-7635
Funding
No grant is acknowledged in the PubMed record.
Abstract
Despite the growing maturity of silicon (Si) and silicon nitride (SiN) for integrated photonics, a single material platform is unable to meet the diversifying requirements posed for photonic integrated circuits
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PMID
42749915What OpenQuestion holds
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Read underepoch 390
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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.