ArticleMaterials (Basel, Switzerland)2026
Flexible h-BN/GaN Heterostructure Thin-Film Piezoelectric Sensors for Harsh Environments.
Article in Materials (Basel, Switzerland), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
Harsh-environment pressure sensing requires piezoelectric materials that can simultaneously withstand elevated temperature, mechanical loading, and structural degradation. GaN is a promising lead-free piezoelectric semiconductor owing to its wide bandgap, high thermal stability, and non-centrosymmetric wurtzite structure. However, its piezoelectric output can be significantly affected by free-carrier compensation in unintentionally n-type GaN. Here, we report a flexible all-inorganic piezoelectric pressure sensor based on a directly grown h-BN/GaN heterostructure thin film. The h-BN layer was deposited on GaN/Si by plasma-enhanced chemical vapor deposition, followed by backside Si removal, electrode deposition, and transfer onto a flexible Cu foil substrate. Structural characterizations confirmed the formation of a compact h-BN/GaN interface with clear lattice fringes, preferential out-of-plane orientation, and characteristic Raman signatures of both h-BN and GaN. Compared with the flexible GaN/Cu reference, the h-BN/GaN device exhibits modified interfacial electrical transport behavior, enhanced voltage and current-density outputs, and prolonged transient voltage retention. Finite-element simulations reveal modified electrostatic potential distribution after h-BN integration, while electrical and interfacial characterizations suggest electronic structure modulation and reduced carrier compensation effects at the heterointerface. Raman optothermal analysis indicates an improved relative/local thermal response of the h-BN/GaN device under identical optical excitation conditions, supporting its enhanced thermal robustness. Under 200 psi at 400 °C, the h-BN/GaN sensor maintains an output voltage of approximately 27.65 mV, about 2.32 times that of the GaN reference. This work demonstrates an interfacial engineering strategy based on two-dimensional h-BN integration for constructing flexible, thermally robust, and high-output piezoelectric sensors for harsh-environment monitoring.
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