ArticleFrontiers in neuroscience2026
On the reliability of non-hermetically encapsulated ceramic printed circuit boards as bridging elements in neural implants.
Article in Frontiers in neuroscience, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
Introduction: Robust, biocompatible ceramic electrical interconnects are essential for bridging the gap between macro-scale components, such as helically wound leads and connectors, and thin-film polyimide electrodes in neural interfaces. While screen-printed thick-film structures have been utilized for decades, there is a need to broaden the design space and improve reliability through thin-film techniques. This study evaluates various surface configurations to identify the optimal combination of mechanical adhesion, electrical insulation, and functional longevity. Methods: All samples were fabricated on 96% pure alumina (Al Results: Tensile shear strength decreased over the aging period across all groups. However, the integration of adhesion promoters increased mechanical stability compared to bare sputtered Pt, with Si Discussion: The findings demonstrate that the addition of adhesion promoters enhances both the longevity of the mechanical bond and stability of the electrical insulation in ion-rich environments. These results provide guidance for selecting optimal ceramic interconnects for chronic peripheral-nerve implants, balancing reliability, manufacturability, and cost.
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