ArticleMolecules (Basel, Switzerland)2026
A Norbornene-Derived Epoxy/Cyanate Ester System with Enhanced Thermal and Dielectric Properties as Electronic Materials.
Article in Molecules (Basel, Switzerland), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
In this work, to meet the requirements of high-performance electronic devices for high-frequency/speed telecommunication and semiconductor packaging, we developed a norbornene (NB)-backboned epoxy/cyanate ester compound system to modify the commercial bisphenol-A (BPA) diglycidyl ether (DGEBA) epoxy resin. A norbornene-based epoxy monomer (ENBDE) and cyanate ester (ENBCY) were synthesized using 5-ethylidene-2-norbornene (ENB) as the key starting material. The ENBDE was blended with DGEBA as the epoxy resin compound, which was cured using ENBCY as the curing agent to form a cross-linked thermoset. The effect of ENBDE content on thermal stability, mechanical properties, dielectric performance, and bonding strength of the thermosets was investigated. The optimized formula showed a significantly improved thermal stability of the cured resin with a glass-transition temperature of 249.2 °C and a 5% weight-loss temperature (T
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