ArticleMicromachines2026
Effect of Surface Tension of Cleaning Solutions on the Cleanability of Through-Glass via (TGV) Substrates.
Article in Micromachines, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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4 authors.
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Abstract
Through-glass via (TGV) substrates have attracted increasing attention as interposers and core substrates for advanced packaging. However, contaminants adhere to glass surfaces; in particular, airborne organic substances increase the contact angle, hindering the penetration of cleaning solutions into TGVs and thereby reducing the cleaning effect. Reducing the cleaning-solution surface tension by adding a surfactant may promote penetration into TGVs with high contact angles. This study investigated the effect of cleaning-solution surface tension on cleanability inside TGVs. Under the tested conditions, the contact angle outside the TGV after cleaning was 3-4° for all cleaning solutions, regardless of their surface tension. In contrast, the contact angle inside the TGV after cleaning decreased with decreasing surface tension. At 27.5 and 41.8 mN/m, the contact angle inside the TGV after cleaning decreased to 3-4° under both conditions. These results indicate that the surface tension of the cleaning solution affects the cleanability inside the TGV. For a TGV with an opening diameter of 20 μm and an aspect ratio of 10, cleaning with a 27.5 mN/m solution prior to electroless Cu plating was associated with reduced void formation and film thickness variation in the Cu film inside the TGV under the tested conditions.
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