ArticleAdvanced science (Weinheim, Baden-Wurttemberg, Germany)2026
Multispectral UV Imaging on Capacitive CMOS Arrays Enabled by Solution-Processed Metal-Oxide Nanoparticles.
Article in Advanced science (Weinheim, Baden-Wurttemberg, Germany), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
Ultraviolet (UV) imagers are important for a variety of applications, such as quality inspection in the semiconductor industry, forensics and food quality inspection, but are often costly because they require dedicated semiconductor process flows. Here, an imaging chip is introduced that has been fabricated using standard 40 nm complementary metal-oxide-semiconductor (CMOS) technology. Instead of using a conventional charge-based photodetection principle, the imager uses a capacitive operation principle where UV-light causes capacitance changes via the photodielectric effect in a functionalization layer, which are measured by the underlying CMOS circuitry. This spin-coated or inkjet-printed functionalization layer consists of solution-processed, wide-bandgap, semiconducting metal-oxide nanoparticles, such as ZnO, SnO
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