ArticleSmall (Weinheim an der Bergstrasse, Germany)2026
All-in-One Interface Engineering From Bulk to Electrode Toward High-Performance Micro-Sized Silicon Anodes.
Article in Small (Weinheim an der Bergstrasse, Germany), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
Interface engineering that simultaneously targets the silicon particle surface and the electrode-level interfaces among silicon particles, binders, and conductive additives is a key direction for addressing the large volume expansion (∼300%) of silicon anodes, especially for low-cost microsized silicon (µ-Si). Herein, an integrated co-carbonized (ICC) electrode was successfully fabricated (µ-Si@C/ICCE) without organic binder and conductive additives. The surface of µ-Si particles and the interface of the electrode evenly distributed a uniform carbon layer, which is attributed to the ICC process of the pre-coated layer of µ-Si particles and the pre-binder of the electrode. This design regulates the µ-Si particles' surface and also robustifies the electrode interface. The µ-Si@C/ICCE exhibited a high initial coulombic efficiency of 86.88% and strong mechanical stability. The µ-Si@C/ICCE electrode was further cycled for 400 cycles and retained a capacity of 1355 mAh g
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