ReviewMaterials (Basel, Switzerland)2026
From Wide- to Low-Bandgap Semiconductors for Transient Photocurrent THz Emission: A Review.
Review in Materials (Basel, Switzerland), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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Authors and funding
3 authors.
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Abstract
Terahertz (THz) radiation generated through ultrafast transient photocurrent mechanisms has become a cornerstone of modern THz photonics, enabling broadband coherent emission with sub-picosecond temporal resolution. This review provides a comprehensive and mechanism-driven analysis of THz pulse generation via photo-Dember diffusion currents, surface depletion field acceleration, and biased photoconductive antenna architectures. We present a comprehensive comparative analysis of wide- and low-bandgap material platforms, including III-V, II-VI, and group IV semiconductors, as well as two-dimensional materials, topological insulators, and Weyl semimetals, highlighting how their intrinsic properties, such as band structure, carrier mobility, recombination dynamics, doping, and dielectric response, govern their THz emission efficiency, bandwidth, and spectral tunability. Special emphasis is placed on germanium (Ge), which has re-emerged as a highly promising THz source material owing to its high carrier mobility, long diffusion lengths, strain-tunable band structure, and CMOS compatibility. We highlight the roles of doping, strain-induced direct transitions, and several fabrication techniques in controlling the nonlinear photoexcited charge-carrier dynamics in Ge, thereby unlocking enhanced broadband THz performance. Finally, we explore the emerging application prospects of THz radiation, ranging from non-invasive security screening to biochemical sensing and archeological preservation. By bridging fundamental material science with scalable device architectures, this review outlines current challenges, highlights evolving opportunities in novel materials, and charts future directions towards integrated THz technologies.
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