ArticleMicromachines2026
Experimental Study on Slicing Sapphire Crystal with Ultrasonic-Assisted Diamond Wire Saw.
Article in Micromachines, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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5 authors.
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Abstract
Sapphire crystal, owing to its high hardness, chemical inertness, thermal stability, optical transparency, and superior dielectric strength, as well as resistance to scratching, abrasion, friction, and wear, is widely utilized in a broad range of engineering applications. Slicing is the most critical step in sapphire industry processing, as it largely dictates the final surface quality and morphology. Conventional wire sawing methods often lead to undesirable surface defects, while ultrasonic-assisted diamond wire sawing (UADWS) offers potential advantages through enhanced abrasive self-sharpening, micro-hammering, and improved lubricant penetration. However, its influence on sapphire slicing remains insufficiently studied. This study investigates the effects of UADWS parameters-ultrasonic amplitude, horn application position, feed speed, and wire speed-on the surface quality of sapphire crystals. Both single-factor and orthogonal five-level experiments were designed, taking wire and feed speed within industrial parameter ranges. Surface roughness (
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