ArticleGels (Basel, Switzerland)2026
Research on Adhesion Performance of Silicone Gel for Power Module Packaging Regulated by Crosslink Structure and Interfacial Connection.
Article in Gels (Basel, Switzerland), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
Silicone gel for high-voltage power module packaging is prone to interfacial failure due to poor intrinsic adhesion, which seriously threatens the reliability of devices. This study explores ways to improve the adhesion performance of silicone gel from the two aspects of crosslink network structure and interfacial connection. The crosslink structure is regulated by adjusting the ratio of side-hydrogen-containing silicone oil to terminal-hydrogen-containing silicone oil, and interface adhesion is improved by adding three different contents of silane coupling agents (KH560, KH570, A171). The adhesion strength is evaluated by lap shear experiments. The results show that when the ratio of side-hydrogen to terminal-hydrogen is 16:24, the adhesion strength reaches a peak value of 0.0921 MPa. Among the coupling agents, KH560 shows the most significant enhancement, with the adhesion strength reaching 0.1356 MPa at 4% addition and a 47% improvement over the baseline, KH570 is only effective at low addition levels, and A171 shows the weakest effect due to vinyl interference in the crosslink network. Breakdown tests confirm that all three modification schemes do not seriously damage insulation performance. This study provides a feasible strategy and basis for the adhesion reliability design of silicone gel for power module packaging.
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