Polydopamine-Modified Boron Nitride Reinforced Silicone Gel Composites with Enhanced Thermal Conductivity and Electrical Insulation Performance.

Silicone gel (SG) is widely used as a soft encapsulation material for high-voltage power devices because of its excellent flexibility, thermal stability, and electrical insulation. However, its intrinsically low thermal conductivity and susceptibility to partial discharge (PD) at triple-junction interfaces restrict long-term operational reliability. In this study, polydopamine-modified hexagonal boron nitride (P-BN) was introduced into silicone gel to construct thermally conductive and electrically insulating composites. The SG/P-BN composites exhibited reduced filler agglomeration and a more continuous filler-matrix morphology than the corresponding SG/BN composites, while the model-extrapolated trap analysis suggested composition-dependent changes in the higher energy charge trapping states of the P-BN-containing composites. As a result, the SG/P-BN composites exhibited enhanced thermal stability, reduced coefficient of thermal expansion, and improved heat-transfer capability, with thermal conductivity increasing from 0.183 W/m·K for pristine SG to 0.25 W/m·K. The composite containing 2 wt% P-BN showed the best insulation performance, with breakdown strength increasing from 24.05 to 28.45 kV/mm at 25 °C and from 19.59 to 24.71 kV/mm at 150 °C. Under a simplified triple-junction laboratory configuration, the PD inception voltage increased from approximately 3.1 kV for pristine SG to 4.1 kV for SG/P-BN