ArticleACS omega2026
Low-Temperature Curable Bisphenol A‑Free Epoxy-Amine Network Enabled by Trifunctional Epoxide Cross-Linking and Benzyl Alcohol for Strong Adhesion, Sweat Durability, and Skin Compatibility.
Article in ACS omega, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
Low-temperature molding materials for skin-contact electronics must reconcile mutually competing requirements: rapid/complete cure with low exotherm, high hardness, durable adhesion to metallic substrates, chemical stability against perspiration, and biocompatibility. Here we report a BPA-free epoxy-amine system derived from a bisphenol-F (BPF) diepoxide, a trifunctional epoxide precursor (TEP), and benzyl alcohol (BA) that together enable a highly cross-linked architecture combining a covalent epoxy-amine network, multipoint cross-linking provided by TEP, and hydrogen-bond-rich interfacial interactions promoted by BA. A fixed 10 wt % TEP content was selected based on preliminary hardness screening to provide a rigid network backbone, while BA was tuned to maximize adhesion without sacrificing cure completeness. Differential scanning calorimetry (DSC) revealed that BA contents up to 20 wt % showed no residual curing exotherm after 5 h at 60 °C, whereas 30 wt % BA produced an uncured exotherm, indicating incomplete conversion. On plasma-activated titanium substrates, the optimized formulation increased ultimate lap-shear load from 3.8 kgf to 8.5 kgf. In an aggressive artificial sweat solution at 60 °C for 48 h, the optimized network exhibited no visible cracks or voids, in contrast to a BPF-only control that degraded under identical conditions. Independent ISO 10993-guided biological evaluation of the optimized formulation further showed noncytotoxicity in the extract test (reactivity grade 1; RCC 94.69%), no skin sensitization in the guinea pig maximization test for either saline or cottonseed-oil extracts (0/10 responders for both), and negligible primary skin irritation with P.I.I. = 0.0 for both extract media. These results demonstrate a practical and scalable route to low-temperature curable epoxy molding materials that integrate high hardness, strong adhesion, sweat durability, and a favorable preliminary biological profile for skin-contact applications.
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Registered trials
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