Comparative Evaluation of Argon and Helium Plasma for Controlled Epidermal Peeling and Dermal Remodeling in Human Skin Tissue.

backgroundPlasma-based devices are increasingly used for skin rejuvenation and epidermal peeling; however, standardized parameters for different plasma gases remain insufficient. Argon (Ar) and helium (He) plasma exhibit distinct physical and biological characteristics, necessitating systematic evaluation to define safe and reproducible treatment conditions.

methodsAn ex vivo human skin explant model was used to evaluate Ar and He plasma generated by the Plasma Magic device under standardized pulse conditions (1 Hz, 500 ms, 2 pulses). Multiple output levels were assessed to identify parameters achieving complete epidermal peeling without dermal injury. Histological analyses and quantitative RT-PCR of extracellular matrix (ECM)-related genes were performed up to 14 days post-treatment. The effects of adjunctive Lactovesicle application were also evaluated.

resultsAr plasma at level 6 and He plasma at level 8 consistently induced uniform epidermal detachment while preserving dermal architecture and maintaining stable inflammatory cell counts. Collagen and elastin synthesis significantly increased between days 7 and 14, accompanied by marked upregulation of ECM-related genes. He plasma showed stronger long-term elastin synthesis and gene induction, whereas Ar plasma promoted faster initial peeling and early collagen remodeling. Lactovesicle application further enhanced ECM regeneration.

conclusionsOptimized Ar and He plasma parameters enable controlled epidermal peeling and sustained dermal remodeling without tissue damage. Plasma-assisted treatment, particularly when combined with topical Lactovesicle, represents a promising strategy for skin rejuvenation and transdermal therapy. LEVEL OF EVIDENCE V: This journal requires that authors assign a level of evidence to each article. For a full description of these Evidence-Based Medicine ratings, please refer to the Table of Contents or the online Instructions to Authors www.springer.com/00266 .