Evidence map›Paper›PMID 42396173›Full record

ArticleNational science review2026

Intimate encapsulation of non-planar electrodes via a viscoplastic interlayer.

Liqian Liu, Xinyue Xiang, Yinglin Zhi, Guoli Chen, Yan Shao, Rui Xia, Daohang Cai, Huiping Wu, Yuda Chen, Jingjia Li and 4 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in National science review, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

14 authors.

Liqian LiuDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
Xinyue XiangDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
Yinglin ZhiDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
Guoli ChenDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
Yan ShaoDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
Rui XiaDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
Daohang CaiDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
Huiping WuDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
Yuda ChenDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
Jingjia LiDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
Fuzeng RenDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
Shiming ZhangDepartment of Electrical and Electronic Engineering, The University of Hong Kong, Hong Kong 999077, China.
Chuanfei GuoDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.ORCID https://orcid.org/0000-0003-4513-3117
Yanhao YuDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.ORCID https://orcid.org/0000-0003-2494-3006

Funding

No grant is acknowledged in the PubMed record.

6 · The paper itself

Abstract

Implantable electronics often adopt non-planar electrodes to resolve the conflict between conductivity and deformability. Encapsulation of these electrodes becomes a critical challenge for conventional elastic seals due to the elastic-contact-induced interfacial voids and consequential fluid ingress. Here, we present a viscoplastic interlayer that can adapt to the three-dimensional structures of non-planar electrodes, resulting in intimate contact and hermetic encapsulation. This interlayer is a polymeric composite that consists of a long-chain polyisobutylene as the matrix, a short-chain polyisobutylene as the plasticizer, and maleic anhydride-grafted polypropylene as the foreign domains. Its viscoplasticity originates from the chain slippage and permanent disentanglement of the long-chain polyisobutylene, promoted by the plasticizers and confining domains, respectively. When synergized with covalent bonding, the interlayer derives defect-free interfaces between the sealing elastomer and various non-planar electrodes, such as microwires, micropillars, and serpentine electrodes. This intimate encapsulation stabilizes the signal-to-noise ratio of an electromechanical device for 50 weeks in acidic, neutral, and alkaline solutions and extends the

Identifiers

PMID42396173
PMCPMC13325494

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.