ArticleCommunications chemistry2026
Recyclable glass fiber-reinforced epoxy copper clad laminates for printed circuit board.
Article in Communications chemistry, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
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Authors and funding
9 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
Epoxy-based copper-clad laminates (CCLs) comprise >60% of the rigid CCL market, yet such CCLs are rarely recyclable at present. This paper describes the first industrialization of recyclable epoxy systems prepared with acetal-functionalized methylenebis(oxy)dianilines (MDAs) degradable curing agents, which make the corresponding CCLs recyclable and reuseable. We systematically studied the curing behaviors as well as the thermal and mechanical properties of these recyclable epoxy systems. All epoxy/MDA systems thermally decomposed at >288 °C, enabling their CCLs to pass the thermal stress test-currently unachieved with vitrimers. The cured networks degraded in acid via acetal hydrolysis to linear polymers. FR-4-type CCLs cured with the three MDAs met all IPC-4101/128 requirements, and their degradation products were reused to prepare Composite Epoxy Material (CEM)-3-type CCLs: a circular life cycle. We industrialized 2,2'-MDA-cured FR-4, including printed circuit board application testing and qualification, scaled-up degradation and recycling in CEM-3, Underwriters Laboratories certification, and standardization.
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Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.