ArticleMolecules (Basel, Switzerland)2026
Thermally Regulated Curing-Degradation Windows of Epoxidized Soybean Oil-Based Epoxy-Anhydride Liquid Plugs for Sustainable High-Temperature Sealing.
Article in Molecules (Basel, Switzerland), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
High-temperature temporary sealing operations require liquid plug materials that can be placed as low-viscosity precursors, converted into mechanically stable networks under reservoir temperature, and subsequently removed after service. Existing epoxy-based sealing systems generally provide high post-curing strength, but the coordination among pumpability, thermally triggered curing, and post-service degradability remains insufficiently addressed. In this work, an epoxidized soybean oil (ESO)-modified epoxy-anhydride liquid plug was designed to regulate these sequential stages within a single material system. The precursor formulation, rheological transition, curing kinetics, mechanical response, network structure, and degradation behavior were evaluated using viscosity monitoring, curing-time tests, DSC, compression testing, DMA, gel fraction and swelling measurements, FTIR, and high-temperature degradation experiments. The optimized precursor exhibited an initial viscosity of 65.4 ± 2.1 mPa·s, remaining below the pumpability threshold of 100 mPa·s before curing. Its curing time was adjustable within 1-10 h at 120-140 °C through temperature and initiator regulation. ESO incorporation produced a non-monotonic mechanical response, with the optimized network reaching a compressive strength of 112.5 ± 3.5 MPa and an elastic modulus of 142.50 ± 5.26 MPa. FTIR and thermal-mechanical analyses supported the formation of an ester-rich epoxy-anhydride network containing both rigid epoxy-derived segments and ESO-derived flexible chains. In the post-service stage, degradation was strongly temperature dependent, with the characteristic unsealing time decreasing from 84 h at 120 °C to 24 h at 130 °C and 18 h at 140 °C. The combined results define a coupled curing-degradation window in which pumpable placement, thermal network formation, load-bearing sealing, and controlled unsealing are temporally separated but structurally connected.
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