ArticleMicromachines2026
Reliability Analysis and Optimization of Power Terminal Solder Joints in PPS-Packaged IPMs.
Article in Micromachines, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
What it found
Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.
The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.
The trial behind it
Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.
Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.
Who cites it
0 citing papers in PubMed.
No citing paper in PubMed yet.
Corrections and comments
PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.
Authors and funding
2 authors.
Funding
No grant is acknowledged in the PubMed record.
Abstract
This study investigates the reliability of power-terminal solder joints in intelligent power modules (IPMs) subjected to thermal cycling, random vibration, and packaging/assembly-induced deformation. Fifty IPMs were tested under temperature cycling from -55 °C to 125 °C and random vibration from 20 to 2000 Hz, and the experimental observations were combined with finite element simulations of thermal, vibration, and deformation loads. The modules survived 200 temperature cycles in the free state, whereas functional abnormalities occurred after board-level assembly and subsequent environmental loading. Simulation results showed that random vibration produced limited solder-layer stress because the first structural mode was above the excitation range, while packaging and PCB deformation markedly increased the initial stress of the power-terminal solder joints. When local deformation reached approximately 0.5 mm, the calculated solder-pad stress reached or exceeded the shear-strength risk range, consistent with the failure tendency observed in highly deformed modules. Weibull analysis further indicated a fatigue-dominated failure process with an increasing failure rate. These findings suggest that deformation control, package stiffness improvement, and assembly flatness management are critical for improving the reliability of IPM power-terminal solder joints.
Indexed as
Identifiers
What OpenQuestion holds
Registered trials
Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.