Optimization and Predictive Modeling of SiC Wafer Dicing Using a Thin Diamond Grinding Wheel via RSM and NSGA-II.

Jian Liu, Meiling Du, Jinzhong Wu, Sheng Gong, Penggen Ouyang, Shuai Huang, Fengjun Chen

Abstract read

In one paragraph

Article in Micromachines, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it

0cells of the map it votes in

0citing papers in PubMed

–field-weighted citation impact

1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

7 authors.

Jian LiuSchool of Robot Engineering, Wenzhou University of Technology, Wenzhou 325000, China.

Meiling DuSchool of Robot Engineering, Wenzhou University of Technology, Wenzhou 325000, China.

Jinzhong WuSchool of Intelligent Engineering, Shaoxing University, Shaoxing 312000, China.ORCID 0000-0002-5229-7278

Sheng GongHefei Accuracy Intelligent Equipment Co., Ltd., Hefei 230094, China.

Penggen OuyangZhejiang Jingrui Electronic Materials Co., Ltd., Shaoxing 312000, China.

Shuai HuangCollege of Mechanical and Vehicle Engineering, Hunan University, Changsha 410082, China.

Fengjun ChenSchool of Robot Engineering, Wenzhou University of Technology, Wenzhou 325000, China.ORCID 0000-0001-5398-8874

Funding

National Natural Science Foundation of China 52375424Wenzhou Municipal Science and Technology Bureau Major Science and Technology Research Project of Wenzhou MunicipalityZhejiang Provincial Natural Science Foundation LZ24E050001

6 · The paper itself

Abstract

To investigate how the process parameters of ultra-thin diamond grinding wheel dicing affect the dicing quality of silicon carbide (SiC) wafers, single-factor experiments were designed. This study examined the influence of key process parameters, including spindle speed, feed rate, and first dicing depth, on the maximum chip width on the front side W

Indexed as

diamond grinding wheeldicingprocess parametersresponse surface analysisSiC wafer

Identifiers

PMID42354717

DOI10.3390/mi17060686

PMCPMC13304418

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.