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ArticleMicromachines2026

A Wafer-Level Stacking Scheme Based on Hybrid Etching and Low-Temperature Bonding for High-Performance MEMS Devices.

Pengfei Li et al.PubMed ↗Full text ↗Publisher ↗

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1 paper cites it

2026

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A Wafer-Level Stacking Scheme Based on Hybrid Etching and Low-Temperature Bonding for High-Performance MEMS Devices. | OpenQuestion