ArticleScientific reports2026
Tuning intermetallic growth and flexural performance in gallium-based amalgams via Sn/In alloying and solidifying at controlled temperature.
Article in Scientific reports, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
Gallium-based amalgams and preforms offer promising pathways for room-temperature bonding and low-temperature structural fabrication, yet their mechanical performance is constrained by brittle failure after interdiffusion-based solidification. This study investigates the mechanical and microstructural evolution of pastes formed by mixing copper particles with gallium (Ga), eutectic gallium-indium (GaIn), eutectic gallium-tin (GaSn), and eutectic gallium-indium-tin alloys (GaInSn), subjected to solidification at either room temperature or 100 °C. Four-point flexural testing showed that Ga and GaSn both strengthened after 100 °C solidification, reaching similar strength levels (~ 7 MPa), whereas GaIn and GaInSn weakened. Fracture surfaces showed plate-like intermetallic cleavage in Ga and GaSn, consistent with a rigid CuGa₂ framework. GaIn and GaInSn displayed more ductile features from dispersed In or InSn regions that disrupt CuGa₂ continuity. Overall, composition and solidification temperature control the balance between rigid intermetallic reinforcement and softer secondary phases. GaSn provides the most practical combination of strength, consistency, and cost for these low-temperature metal systems.
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