ArticleSmall methods2026
Dielectric-Conductive Dual-Shell Structure Design Overcome the Lightweight-High Strength and Electrical-Thermal Conductance Trade-Off.
Article in Small methods, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
The advancement of modern electronic devices toward lightweighting, high-frequency, and integrated designs has escalated the demand for multifunctional materials that can combine microwave and thermal management capabilities with mechanical load-bearing capacity. However, inherent trade-offs exist between electrical conductivity and thermal insulation, as well as between mechanical strength and lightweight properties. Herein, attempts have been made to innovatively embed lightweight, high-strength dielectric shells and highly conductive, low-infrared-emissivity metallic shells into hollow structure design. Specifically, heterogeneous dual-shell hollow microspheres (DSHM) were constructed using glass as the model dielectric material and copper as the conductive material. By optimizing the ratio of dielectric-to-conductive phases, the shell microstructure, and macroscopic structural parameters, we achieved a synergistic combination of lightweight and high strength (density: 0.4456-1.0991 g cm
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