ReviewMaterials (Basel, Switzerland)2026
Friction Stir Welding of Dissimilar Materials: A Review on Joining Mechanism, Defects, and Process Optimization.
Review in Materials (Basel, Switzerland), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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5 authors.
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Abstract
The dissimilar joining of aluminum alloy and carbon fiber-reinforced polymer (CFRP) is critical for lightweight manufacturing in transportation and aerospace sectors, yet it remains challenging due to their substantial differences in physical and chemical properties. This paper systematically reviews friction stir welding (FSW) of aluminum alloy and CFRP, and compares it with laser welding, induction welding, resistance welding, and ultrasonic welding. The comparative analysis indicates that while each alternative process presents distinct limitations in thermal management, heating uniformity, or joint configuration, FSW demonstrates the most balanced overall performance, uniquely combining single-pass long-distance capability, low heat input, and broad industrial applicability. Through systematic parametric analysis, the optimal FSW processing window is quantitatively established as a tool rotation speed of 1200-1500 rpm combined with a traverse speed of 30-50 mm/min. Under these optimized conditions, the CFRP side remains below its thermal degradation threshold of 350 °C, the defect volume fraction is reduced from 12% to below 3%, and the maximum joint tensile strength reaches 78 MPa, representing 65% of the base CFRP strength. The interfacial bonding mechanisms are identified as mechanical interlocking and localized chemical bonding, which however cover only approximately 30% of the interfacial area. Optimization strategies, including surface modification, auxiliary structures, nanoparticle reinforcement, and external field assistance, are evaluated for their effectiveness in improving joint quality. Finally, critical challenges and future research directions toward engineering application are outlined.
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