Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging.

Pengrong Lin, Zirui Tong, Shimeng Xu, Yiping Wang, Shang Wang, Yanhong Tian

Abstract read

In one paragraph

Article in Materials (Basel, Switzerland), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it

0cells of the map it votes in

0citing papers in PubMed

–field-weighted citation impact

1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

6 authors.

Pengrong LinBeijing Microelectronics Technology Institute, Beijing 100076, China.

Zirui TongState Key Laboratory of Precision Welding & Joining of Materials and Structures, Harbin Institute of Technology, Harbin 150001, China.

Shimeng XuBeijing Microelectronics Technology Institute, Beijing 100076, China.

Yiping WangState Key Laboratory of Precision Welding & Joining of Materials and Structures, Harbin Institute of Technology, Harbin 150001, China.

Shang WangState Key Laboratory of Precision Welding & Joining of Materials and Structures, Harbin Institute of Technology, Harbin 150001, China.ORCID 0000-0002-4540-3263

Yanhong TianState Key Laboratory of Precision Welding & Joining of Materials and Structures, Harbin Institute of Technology, Harbin 150001, China.

Funding

National Natural Science Foundation of China 52205352National Natural Science Foundation of China U2241223

6 · The paper itself

Abstract

Silver pastes are promising joining materials for use in advanced electronic packaging, particularly in power electronics, due to their capacity for low-temperature joining and high-temperature operation. However, spherical silver particles suffer from low sintering efficiency and high porosity due to their limited contact areas. In this study, a submicron triangular silver flake paste was investigated to overcome these limitations. A high joint strength of 35.2 MPa with a low porosity of 9.48% was achieved at 250 °C via pressureless sintering. A relatively high thermal conductivity (134.9 W/(m·K)) was also achieved. This enhanced sintering performance is attributed to a unique mechanism involving distinct same-layer and inter-layer sintering processes at different temperatures. With these findings, we demonstrate that the submicron triangular silver flake paste is a high-strength, high-thermal-conductivity, low-temperature bonding material for advanced electronic packaging.

Indexed as

advanced electronic packagingpastesilver flakessintering mechanism

Identifiers

PMID42279836

DOI10.3390/ma19112182

PMCPMC13258792

What OpenQuestion holds

Textmetadata

LicenceCC BY

Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.