ArticleIEEE journal on flexible electronics2026
E-Link: A 256-ch Mini-Pedestal Connector for High-Density Soft Neural Interfaces.
Article in IEEE journal on flexible electronics, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Abstract
High-density thin-film neural interfaces face persistent packaging challenges at the electrode-electronics interface, where conventional rigid connectors impose high insertion forces, strict alignment requirements, and limited reusability. We present E-Link (Elastomeric Link), a modular 256-channel mini-pedestal connector designed to facilitate simplified, user-friendly assembly through an insertion-free, alignment-tolerant interface utilizing an elastomeric conductive interposer and a compliant threaded compression mechanism. Finite element analysis and experimental validation confirm uniform contact stress across the 16 × 16 interconnect array. The system achieves stable electrical performance, exhibiting contact impedances of 0.3-0.4 kΩ, an RMS noise floor of 2.68 ± 0.46 μV, and a connection yield exceeding 97% over 100 mating cycles. The detachable architecture reduces chronic head-mounted mass from 6.6 g to 2.8 g while maintaining safe thermal operation (30.5 °C steady-state) under a full 20 kHz sampling bandwidth. Design analysis further indicates scalability toward 1024-channel integration within the same 25-mm-diameter footprint by leveraging fine-pitch elastomeric conductive pillars. This work provides a robust and scalable connection solution for high-density flexible neural interfaces with broad application for bioelectronics.
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