Double-Sided Mechanical Interlocking Enables Soft-Rigid Conductive Interfaces With a Record High Toughness for Flexible Electronics.

Gang Li, Minkun Cai, Chunyan Cao, Zengbai Ouyang, Hong Fu, Lingyu Zhao, Bingang Xu

Abstract read

In one paragraph

Article in Advanced materials (Deerfield Beach, Fla.), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it

0cells of the map it votes in

0citing papers in PubMed

–field-weighted citation impact

1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

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Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

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0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

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5 · Who and what money

Authors and funding

7 authors.

Gang LiNanotechnology Center, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong, China.

Minkun CaiDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, China.

Chunyan CaoSchool of Electrics and Computer Engineering, Nanfang College Guangzhou, Guangzhou, China.

Zengbai OuyangDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, China.

Hong FuDepartment of Mathematics and Information Technology, The Education University of Hong Kong, Hong Kong, China.

Lingyu ZhaoDepartment of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, China.ORCID https://orcid.org/0009-0009-1111-4402

Bingang XuNanotechnology Center, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong, China.ORCID https://orcid.org/0000-0002-1277-8747

Funding

Basic Research Program of Shenzhen JCYJ20230807093559046Hong Kong Polytechnic University 1-BBH6Hong Kong Polytechnic University 1-CDPFHong Kong Polytechnic University 1-W34UHong Kong Polytechnic University 4-YWERNational Natural Science Foundation of China 92471203The Education University of Hong Kong ITS/297/23 02A22

6 · The paper itself

Abstract

The pronounced mismatch between polymeric electrodes and metallic components hinders the formation of robust electrical contacts. While most approaches rely on chemical design to strengthen interfacial interactions, we present a double-sided mechanical interlocking strategy that provides both stability and adaptability. A conductive fabric scaffold bridges polymers and metals, with adhesives sequentially applied to both sides. The adhesive infiltrates and encapsulates scaffold fibers, forming a thread-hole adhesion that can only be disrupted by bulk failure. This mechanism achieves a record high interfacial toughness of 730 J m

Indexed as

conductive polymerflexible electronicsmechanical interlocksoft‐rigid interfacethread‐hole

Identifiers

PMID42265874

DOI10.1002/adma.73649

PMCPMC13361169

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Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.