ArticleLangmuir : the ACS journal of surfaces and colloids2026
Engineering Dynamic Hydrophobic Domains in Bioreinforced Ionic Hydrogels for Robust and Transparent Soft Electronics.
Article in Langmuir : the ACS journal of surfaces and colloids, 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.
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Authors and funding
4 authors.
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Abstract
Conductive hydrogels are attractive platforms for soft electronic materials; however, many high-performance systems rely on conductive fillers, complex multinetwork architectures, or multistep processing that compromise scalability and structural clarity. Here, we report a bioreinforced, filler-free ionic hydrogel engineered through micelle-mediated dynamic hydrophobic domains within a hydrogen-bonded polymer network. Stearyl methacrylate is incorporated into a poly(acrylamide) matrix via SDS-assisted micellization, while gelatin serves as a renewable macromolecular reinforcement, establishing a cooperative network governed by reversible hydrophobic associations and extensive hydrogen bonding. This structure-guided design enables efficient energy dissipation and rapid elastic recovery without permanent structural damage. The optimized hydrogel exhibits ultrahigh stretchability (2420%), enhanced fracture stress (0.31 MPa), high optical transparency (∼85.9%), and low mechanical hysteresis, while maintaining stable ionic conductivity through NaCl incorporation. The dynamic network architecture supports reliable electromechanical response over a wide strain range (0.5-650%), with a maximum gauge factor of 12.08, fast response/recovery times, and excellent cyclic durability. Beyond device-level performance, this work demonstrates how controlled micelle-mediated hydrophobic domain engineering in a bioreinforced polymer matrix can generate mechanically robust, transparent, and conductive soft materials without nanofillers or complex processing. The straightforward one-pot synthesis and use of low-cost components highlight the scalability of this platform for next-generation soft electronic and wearable systems.
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Registered trials
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