Evidence map›Paper›PMID 42240080›Full record

ArticleSmall (Weinheim an der Bergstrasse, Germany)2026

Solid-State Crystallization Regulation Enables High-Performance Thermally Evaporated CsPbI

Yuanhao Cui, Jixuan Yang, Mengmeng Lu, Na Meng, Junhao Liu, Yuxuan Wei, Yulin Zhang, Ziqiang Wang, Yajing Li, Yutian Xu and 7 more

Abstract read
PubMed Full text at PMC Publisher
In one paragraph

Article in Small (Weinheim an der Bergstrasse, Germany), 2026. The graph could read no effect estimate from its abstract, so it casts no vote on the map. Not yet cited in PubMed.

0numbers the graph read from it
0cells of the map it votes in
0citing papers in PubMed
–field-weighted citation impact
1 · What the graph read from it

What it found

Each row is one number read from the abstract, on the scale the paper reported it, with its interval. Left of the dashed line favours the treatment, right favours the comparator. Under each row is the sentence it came from. New to these charts? A ten-minute tutorial.

The abstract states no effect estimate the extractor could read, or names no intervention and outcome on the map, so this paper lights no cell and moves no belief. It is still indexed, cited and linked below.

2 · The registry

The trial behind it

Trials whose registry record cites this paper, or whose number appears in the abstract. A trial that started after this paper was published is citing it as background, not reporting it.

Neither the registry nor the abstract names a trial number. If this is a trial report, that itself is worth knowing.

3 · Its place in the literature

Who cites it

0 citing papers in PubMed.

No citing paper in PubMed yet.

4 · The record

Corrections and comments

PubMed lists nothing against this paper. Absence here is not a guarantee, only a check that was made.

5 · Who and what money

Authors and funding

17 authors.

Yuanhao CuiState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.
Jixuan YangState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.
Mengmeng LuState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.
Na MengState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.
Junhao LiuState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.
Yuxuan WeiState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.
Yulin ZhangState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.
Ziqiang WangState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.
Yajing LiState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.
Yutian XuState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.
Huili MaState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.ORCID https://orcid.org/0000-0003-0332-2999
Xue MinState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.
Zhelu HuState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.ORCID https://orcid.org/0009-0002-2232-4447
Lingfeng ChaoState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.
Yingdong XiaState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.
Qingxun GuoState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.
Yonghua ChenState Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Nanjing Tech University (NanjingTech), Nanjing, Jiangsu, 211816, China.ORCID https://orcid.org/0000-0002-9694-4246

Funding

Basic Research Program of Jiangsu BK20243057Jiangsu Provincial Departments of Science and Technology BE2022023Jiangsu Provincial Departments of Science and Technology BK20220010Jiangsu Provincial Departments of Science and Technology BK20241875Jiangsu Provincial Departments of Science and Technology BZ2023060National Key Research and Development Program of China 2023YFB4204500National Natural Science Foundation of China 22379067National Natural Science Foundation of China 22425903National Natural Science Foundation of China 62288102National Natural Science Foundation of China T2441002National Natural Science Foundation of China U24A20568open research fund of Suzhou Laboratory SZLAB-1308-2024-ZD006
6 · The paper itself

Abstract

Thermal evaporation is an industry-compatible deposition technique with strong potential for scalable inorganic perovskite solar cells (PSCs), yet the performance of fully thermally evaporated CsPbI

Indexed as

all‐inorganic perovskitecrystallization regulationthermal evaporation

Identifiers

PMID42240080
PMCPMC13411040

What OpenQuestion holds

Textmetadata
Read underepoch 390

Registered trials

None linked

Read under generation 80e0d062 · epoch 390. Bibliography from PubMed, PubMed Central and OpenAlex; grants from NIH RePORTER; trial links from ClinicalTrials.gov; estimates, votes and beliefs from the OpenQuestion graph.